The simulation result reveals that there is an approximate linear relation between mirror deflection and the square of applied voltage. 仿真结果显示,驱动电压较小时,镜面变形与驱动电压平方近似成线性关系。
After the feedback control law of negative identified deflection and its velocity is chosen, an explicit formula of control voltage applied to the piezoelectric actuators is deduced out. 在采用挠度和速度信号的负反馈控制律后,导出了控制电压的显式表达公式。
This paper has put forward the quantity relationship between the phase speed and the electron in best bandwidth condition of helix deflection and pointed out the accelerating voltage at maximum deflection sensitivity is not the synchronization voltage. 本文提出了螺旋形慢波线最佳带宽时的相速与电子速度之间的数量关系;指出偏转灵敏度最高时的加速电压并不是同步电压。
Analysis of deflection and pull-in voltage of a multi-layer cantilever under an electrostatic load 多层悬臂梁静电作用下的弯曲及吸合电压分析
Following in detail a deflection driver circuit of 2/ 3 inch all-electrostatic camera tubes is described. Finally, the voltage parameters of the feed system are given. 接着,文章对2/3英寸全静电摄像管扫描驱动电路进行较详细介绍,最后,给出该供电系统的电压参数。
Measurement of Deflection-Voltage Curve of Piezoelectric Ceramics 压电陶瓷的δ&V曲线测试
Analyses state that deflection angle of the scanning micromirror varies linearly with the length of piezoelectric beam and applied voltage. 分析表明,微镜偏转角与压电悬臂长度和工作电压呈线性关系。
Results show that the deflection increases continuously until the critical voltage is reached, the beam end deflection is 0 42~ 0 44 the initial gap distance. 结果表明,电压增高,梁的挠度随之增大,达到临界电压时,梁末端的挠度与变形前的间隙之比为042~044。
Regarding above 2 frequency division governor deflection, with the voltage and velocity modulation unifies to carry on supplementary, has analyzed the characteristic of the frequency conversion velocity modulation and the voltage and velocity modulation, it has realized the entire scope velocity modulation plan. 对于2分频以上的调速范围采用与调压调速相结合的方式进行互补,分析了变频调速与调压调速的特点,实现了全范围调速方案。
The relations between the tip deflection of the beam and the thickness ( or elastic modulus) of the interlayer are analyzed by the numerical calculation while the external force ( or applied voltage) is changed. 通过数值计算分析了外力或电压变化时,复合压电双晶片输出位移与夹层厚度、夹层弹性模量的关系。